Home » Accessories » Processor/case Fans » LPALV12BK

Lepa Lpalv12 Cooling Fan/heatsink - 1 X 4.72" - 2200 Rpm - Ball Bearing -... 

Oops! It appears we are out of stock or no longer selling this product.

Model: LPALV12-BK

Search Beach Audio for similar products

   

Description

  • Excellent Thermal Conductivity. Louver design helps the airflow movement into an "U-shape" aluminum fin to increase the path of thermal conductivity.
  • Exceptional Heat Transfer E?ciency. Louver fin breaks the thermal boundary layer to increase heat exchange rate.
  • Superior Contact. H.D.T. (Heatpipe Direct Touch) Technology ensures rapid thermal conduction and eliminates CPU hot spot.
  • Compatibility. Slim heat sink tower design increases RAM installation flexibility. ?Higher Durability. S.N.T.C (Super Nano Thermal Conductive) coating protects heat sink to avoid oxidation, keeps excellent heat transfer e?ciency and extends the life expectancy of the cooler.
  • Patented APS control. Intelligent APS (Adjustable Peak Speed) control of the cooling fan directly provides 3 peak RPM selections for user preferences.
  • BOL Bearing. Barometric Oilless (BOL) Bearing for long life span and silent spinning.
  • Characteristics. Black or White colors are available. ?Silence with High Performance. Sophisticated fin gap calculation leads the ultra balancing between fan speed and heat transfer e?ciency.
  • Easy Installation. All-in-one bracket for both latest Intel® and AMD® sockets.

Features

Application/Usage: Processor

Specification

General Information
ManufacturerLEPA TECHNOLOGY CORPORATION
Manufacturer Part NumberLPALV12-BK
Manufacturer Website Addresshttp://www.lepatek.com
Brand NameLEPA
Product ModelLPALV12
Product NameLPALV12 Cooling Fan/Heatsink
Marketing Information
  • Excellent Thermal Conductivity. Louver design helps the airflow movement into an "U-shape" aluminum fin to increase the path of thermal conductivity.
  • Exceptional Heat Transfer E?ciency. Louver fin breaks the thermal boundary layer to increase heat exchange rate.
  • Superior Contact. H.D.T. (Heatpipe Direct Touch) Technology ensures rapid thermal conduction and eliminates CPU hot spot.
  • Compatibility. Slim heat sink tower design increases RAM installation flexibility. ?Higher Durability. S.N.T.C (Super Nano Thermal Conductive) coating protects heat sink to avoid oxidation, keeps excellent heat transfer e?ciency and extends the life expectancy of the cooler.
  • Patented APS control. Intelligent APS (Adjustable Peak Speed) control of the cooling fan directly provides 3 peak RPM selections for user preferences.
  • BOL Bearing. Barometric Oilless (BOL) Bearing for long life span and silent spinning.
  • Characteristics. Black or White colors are available. ?Silence with High Performance. Sophisticated fin gap calculation leads the ultra balancing between fan speed and heat transfer e?ciency.
  • Easy Installation. All-in-one bracket for both latest Intel® and AMD® sockets.
Packaged Quantity1
Product TypeCooling Fan/Heatsink
Fan Information
Number of Fans1
Fan Speed (rpm)1 x 2200 rpm
Fan Bearing TypeBall Bearing
Air Flow1 x 112 CFM
Heatsink Information
Number of Heat Pipes4
Thermal Resistance32.2°F/W (0.1°C/W)
Compatible Processor Socket
Interfaces/Ports
Connectors4-pin PWM
Physical Characteristics
Material
Fan Diameter1 x 120 mm
Fan Thickness1 x 0.98"
Heatsink Height6.30"
Heatsink Width2.36"
Heatsink Depth5.43"
Height6.3"
Width3.3"
Depth5.4"
Title
ProductTitleLEPA LPALV12 Cooling Fan/Heatsink - 1 x 120 mm - 2200 rpm - Ball Bearing - Socket T LGA-775, Socket H2 LGA-1155, Socket H LGA-1156, Socket B LGA-1366, Socket R LGA-2011, Socket H3 LGA-1150, Socket AM2 PGA-940, Socket AM2+ PGA-940, Socket AM3 PGA-941, Socket AM3+, Socket FM1, ... Compatible Processor Socket - Copper, Aluminum

Warranty Information

Limited Warranty1 Year
Beach Audio Warranty

This product was added to our catalog on Monday, November 28, 2016.

Code:3-lpalv12-bk

NetSuite ecommerce design

© 2014 Beach Audio, Inc. All Rights Reserved