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Intel BXSTS100C Nehalem Combination Thermal Soluti 

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Model: BXSTS100C_25

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Intel combo boxed thermal solution for 2-socket servers/workstations. Maximum cpu tdp: 130w. Combination heat sink with removable fan. For lga1366 nehalem xeons.


Maximum CPU TDP: 130W

With fan Installed:

  • Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink

With fan removed:

  • Pedestal chassis with ducted airflow to heat sink
  • 2U or larger rack chassis with ducted airflow to heat sink

  • Intel Xeon processors
  • Intel LGA1366 socket

Application/Usage: Processor


General Information
ManufacturerIntel Corporation
Manufacturer Part NumberBXSTS100C
Manufacturer Website Addresshttp://www.intel.com
Brand NameIntel
Product NamePassive/Active Combination Heat-Sink with Removable Fan
Packaged Quantity1
Product TypeCooling Fan/Heatsink
Fan Information
Number of Fans1
Heatsink Information
Compatible Processor SocketSocket B LGA-1366
Physical Characteristics
ProductTitleIntel STS100C Thermal Solution - Number of Fans : 1 - Socket B LGA-1366 Compatible Processor Socket - Copper

Warranty Information

Beach Audio Warranty

This product was added to our catalog on Tuesday, April 11, 2017.


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