Thermaltake
Thermaltake CLO023GROSGMA Thermal Compound 4g
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- SKU:
- 18394091
- MPN:
- cl-o023-grosgm-a
- Availability:
- Usually ships the same or next business day.
- Shipping:
- Calculated at Checkout
- Stock Update:
- 01/24/2026 10:54:40 PM PST
- Stock Update:
- 01/24/2026 10:54:40 PM PST
Description
This item is brand-new, factory sealed.
Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A- [Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
- [All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
- [Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
- [Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking
- Brand: ?Thermaltake
- Item model number: ?CL-O023-GROSGM-A
- Item Weight: ?0.317 ounces
- Package Dimensions: ?6.93 x 3.23 x 0.59 inches
- Manufacturer: ?Thermaltake
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs.P/N: CL-O023-GROSGM-ATHERMAL CONDUCTIVITY: 4.5 W/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 76 Pa-sTHERMAL IMPEDANCE: 0.185C -in /WDENSITY: 2.55 g/cm
Package Contents:
- TG-30 Thermal Compound
- Scraper
- 2 x Pack of Alcohol Pads
- Honeycomb Stencil
Features
Package Contents:
China
- TG-30 Thermal Compound
- Scraper
- 2 x Pack of Alcohol Pads
- Honeycomb Stencil
Additional Information:
- Viscosity: 76 Pa-s
- Thermal Impedance: 0.185°C -in²/W
- Density: 2.55 g/cm?
Country of Origin:
China
Specs
| Physical Characteristics | |
| Weight (Approximate) | 0.14 oz |
| Product Color | Gray |
| Warranty | |
| Limited Warranty | 2 Year |
| General Information | |
| Brand Name | Thermaltake |
| Manufacturer Website Address | http://www.thermaltakeusa.com |
| Marketing Information | High Thermal Conductivity The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user's primary needs. Easy to Apply Thermaltake's specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs. All-In-One Application Kit This thermal compound application kit includes a set of easily-applied tools for immediate use. Sustainability and Safety The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system. |
| Product Type | Thermal Grease |
| Product Name | TG-30 Thermal Compound |
| Manufacturer | Thermaltake Technology Co., Ltd |
| Manufacturer Part Number | CL-O023-GROSGM-A |
| Product Model | TG-30 |
| Technical Information | |
| Dispenser Type | Syringe |
| Thermal Conductivity | 4.5W/m?K |
Warranty Information
All Items are Brand New, Factory Sealed and come with a standard warranty. [Read our policies]
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Thermaltake CLO023GROSGMA Thermal Compound 4g
$27.82